logo
EN_US
logo
EN_US

PCB MATRIX

HDI PCBs – High Density Interconnect PCBs

HDI boards, short for High Density Interconnects, are high-density printed circuit boards manufactured using micro-blind/buried via technology and stacked-layer processes. This results in more compact circuits, faster signal transmission speeds, and a complete revolution in the design and manufacturing of electronic devices. HDI boards can integrate more functions in a smaller space, making devices thinner, lighter, and more efficient. They are core components of high-end electronic products such as mobile phones, 5G devices, and automotive electronics.

HDI – 10L: materials: FR-4 TG170; finished thickness: 1.6mm +/- 10%; BGA size: 0.25mm; line width/space: 0.10/0.10 mm; Min.hole size: 0.20mm; surface treatment: ENIG + Hard Gold

HDI – 6L: materials: FR-4 TG150; finished thickness: 1.2mm +/- 10%; line width/space: 0.10/0.10 mm; Min.hole size: 0.15mm; surface treatment: ENIG

HDI (High-Density Interconnect) circuit boards are typically classified by layer. Based on the complexity of microvia stacking and manufacturing processes, they are commonly categorized as follows:

Level 1 HDI: Only one laser drilling process is used to create the microvias.

Level 2 HDI: Two laser drilling processes are involved; microvias can be stacked (overlapping) or staggered.

Level 3 and above/Any-Layer Interconnect HDI: Any two layers can be directly connected via microvias. This is the most advanced HDI technology, offering the greatest wiring freedom but also the highest cost. It is commonly used in high-end smartphones and server CPU motherboards.

UMEC has extensive experience in HDI board manufacturing across multiple sectors and collaborates with numerous certified manufacturers (with deep production experience) to meet the HDI board needs of various industries.

If you need further information or assistance, please contact us and we will be happy to help.

Our technical capability for HDI PCBs

The table below shows some of our basic process capability parameters. If you don’t find the information you need in the table, please contact us and we will be happy to help you solve your problem. In addition, other pages also have information about board materials and other types of circuit boards, which can help you make design or production decisions.

HDI PCB Manufacture Capabilites
No. Item Standard Advanced
1 Materials Materials FR-4 Middle, High Tg, Halogen Free, High CTI, High Speed, High frequency FR-4 Middle, High Tg, Halogen Free, High CTI, High Speed, High frequency
2 Basic parameters Layers 4-32L 48L
3 HDI builds 6+N+6 8+N+8
4 Max.Board size 610*450mm 1000*600mm
5 Min.Board size 10*10mm 5*5mm
6 Max.Board thickness 6.5mm 10mm
7 Min.Board thickness 0.3mm 0.2mm
8 Tolerance of board thickness(＞1.0mm) ±10% ±10%
9 Tolerance of board thickness(≤1.0mm) ±0.1mm ±0.1mm
10 Drilling Min.Drilling hole(mech) 0.2mm 0.15mm
11 Min.Drilling hole(laser) 0.1mm 0.075mm
12 Min.Buried hole(mech) 0.3mm 0.2mm
13 Finish hole tolerance(PTH) ±0.075mm ±0.075mm
14 Finish hole tolerance(NPTH) ±0.05mm ±0.05mm
15 Hole position deviation ±0.075mm ±0.075mm
16 Min.Distance between via and conductors 0.2mm 0.12mm
17 Min.Drilling spacing between holes(the same network) 0.2mm 0.15mm
18 Min.Drilling spacing between holes(for different networks) 0.3mm 0.2mm
19 Max.Micro-via/ Land PAD design 0.4/0.6mm 0.4/0.6mm
20 Min.Micro-via/ Land PAD design 0.075/0.225mm 0.05/0.2mm
21 Aspect ratio(mech drill) 10:1 15:1
22 Aspect ratio(laser drill) 0.8:1 1:1
23 Inner layer Min.Line width/space 2/2mil 1.6/1.6mil
24 Max.Copper thickness 2oz 2oz
25 Min.Copper thickness 1/2oz 1/2oz
26 Outer layer Min.Line width/space 2/2mil 1.6/1.6mil
27 Max.Copper thickness 2oz 2oz
28 Min.Copper thickness 1/2oz 1/2oz
29 Min.BGA pad size 12mil(8mil for electrical soft gold board) 10mil(7mil for electrical soft gold board)
30 Finish Line tolerance ±1mil ±0.5mil
31 Testing method Electrical testing Flying needle test, needle bed test Flying needle test, needle bed test
32 Surface treatment Surface treatment HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Plating Tin, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Ink. HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Plating Tin, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Ink.
33 Mixed surface treatment GF+OSP, GF+HASL, OSP+ENIG, IAG+GF, Isn+GF GF+OSP, GF+HASL, OSP+ENIG, IAG+GF, Isn+GF
34 Routing Routing Tolerance(Laser) ±0.05mm ±0.05mm
35 Routing Tolerance(CNC) ±0.15mm ±0.1mm
36 Others Via treatment method Through hole window opening, through hole cover oil, through hole plug oil, through hole plug resin/copper paste Through hole window opening, through hole cover oil, through hole plug oil, through hole plug resin/copper paste
37 Warp and Twist ≤0.7% ≤0.5%
38 Controlled Impedance ±10% ±5%
39 Special process Gold fingers, half-holes, metal edging, stepped grooves, etc. Gold fingers, half-holes, metal edging, stepped grooves, etc.