We are proud to say that our partner has China’s largest design center, with over 800 experienced engineers providing efficient design services to clients worldwide. They collaborate deeply with major integrated circuit companies, accumulating over 20 years of industry design experience. In the face of ever-changing markets and new customer requirements, rapid response and adaptation are essential capabilities.
Android, Linux, WinCE, Ubuntu, Debian, BSP board-level integrated development.
SDRAM, DDR2, DDR3, LPDDR3, DDR4, LPDDR4, eMMC, NAND FLASH, SPI FLASH, QSPI FLASH, EEPROM, SRAM, SSD, hard drive, USB flash drive.
UART, I2C, SPI, CAN, LIN, Ethernet, USB 2.0, USB 3.0, Type-C, SDIO, PCI Express (PCIe), SATA, SerDes, wireless communication, peripheral bus
HDMI, DVI, VGA, LVDS, MIPI, DSI, DisplayPort (DP), CVBS, EDP, SDI, capacitive touch, and resistive touch.
NXP, Rockchip, Allwinner, Texas Instruments
Xilinx, Nvidia, Intel, Horizon Robotics
