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PCB MATRIX

Rigid-Flex PCBs

Rigid-flex boards are an innovative composite material that combines flexible printed circuit boards (FPCs) with rigid printed circuit boards (PCBs), giving them both the flexibility of flexible substrates (such as polyimide) and the strength of rigid substrates (such as fiberglass). Their core process achieves seamless integration of the two materials, enabling products to simultaneously meet requirements for space adaptability (flexible installation) and structural stability (mechanical strength of 50-100 MPa). They can be used in products with specific requirements, providing both flexible and rigid areas, significantly contributing to saving internal space, reducing overall product volume, and improving product performance.

Rigid-Flex – 4L: materials: Dupont AP9131 + Shengyi S1000H; finished thickness: 1.6mm +/- 10%;  surface finish: ENIG 2U”

Rigid-Flex – 6L: materials: ITEQ IF-2LD2518 + IT180A; Via on pad: resin plug hole; surface finish: ENIG 2U”

Available structures for rigid flex PCBs

There are numerous, different structures available. The more common ones are defined below:

Traditional Rigid-Flex Structure: Multilayer rigid-flex circuitry containing three or more layers with plated through-holes. Maximum of 20 layers is possible, including 10 flexible layers.

Asymmetric Rigid-Flex Structure: Flexible printed circuit board (FPC) located outside the rigid structure. Contains three or more layers with plated through-holes.

Multilayer Rigid-Flex Structure: Rigid structure containing buried/blind vias (microvias). Two layers of microvias are possible. The structure can also contain two rigid structures forming a single unit. Capable of 2+n+2 HDI structures.

Rigid-flex PCBs are complex products. Leveraging our extensive experience and advanced equipment, we focus on producing high-quality rigid-flex PCBs. Our PCBs are not only structurally reliable but also offer superior electrical performance, making them ideal for compact and complex electronic devices requiring high stability and precision.

If you need further information or assistance, please contact us and we will be happy to help.

Our technical capability for rigid flex PCBs

The table below shows some of our basic process capability parameters. If you don’t find the information you need in the table, please contact us and we will be happy to help you solve your problem. In addition, other pages also have information about board materials and other types of circuit boards, which can help you make design or production decisions.

Rigid‐Flex PCB Manufacture Capabilites
No. Item Standard Advanced
1 Materials Flex Adhesiveles FCCL Adhesiveles FCCL
2 Rigid Middle, High Tg, LF, HFPI, High Frequency Middle, High Tg, LF, HFPI, High Frequency
3 Low Flow Epoxy adhesive series, Acrylic adhesive series Epoxy adhesive series, Acrylic adhesive series
4 Coverlayer Epoxy adhesive series, Acrylic adhesive series Epoxy adhesive series, Acrylic adhesive series
5 Basic parameters Layers 2‐12(10 flex layers) 13‐20(18 flex layers)
6 Max. board size 400mm*550mm 400mm*750mm
7 Min. board size 10mm*15mm 5mm*10mm
8 Board thickness 0.3mm‐3.0mm 0.3mm‐4.0mm
9 Tolerance of boad thickness(thickness＞1.0mm) ±10% ±10%
10 Tolerance of boad thickness(thickness≤1.0mm) ±0.1mm ±0.1mm
11 Drilling Min.Drilling hole(mech) 0.15mm 0.1mm
12 Min.Drilling hole(laser) 0.075mm 0.05mm
13 Min.Blind hole 0.15mm 0.1mm
14 Finish hole tolerance(PTH) ±0.075mm ±0.075mm
15 Finish hole tolerance(NPTH) ±0.05mm ±0.05mm
16 Hole position deviation ±0.075mm ±0.075mm
17 Min.Distance between via and conductors 6mil (≤6layer) 5mil (≤6layer)
18 9mil (7~11layer) 7mil (7~11layer)
19 12mil (≥12layer) 9mil (≥12layer)
20 Min.Drilling spacing between holes(the same network) 0.2mm 0.15mm
21 Min.Drilling spacing between holes(for different networks) 0.3mm 0.2mm
22 Aspect ratio(mech drill) 10:1 20:1
23 Inner layer Min. line width/spacing (12/18um copper) 3.5/3.5mil (3.2/3.2mil) 3.0/3.0mil  (2.8/2.5mil)
24 Min. line width/spacing (35um copper) 4.0/4.0mil (3.6/3.7mil) 3.5/3.5mil (3/3.1mil)
25 Min. line width/spacing (70um copper) 6/6.5mil (5.5/6mil) 5/6mil (4.5/5.5mil)
26 Max.Copper thickness 2oz 3oz
27 Min.Copper thickness 1/2oz 1/2oz
28 Outer layer Min. line width/spacing (18um copper) 3.5/3.8mil (3.2/3.5mil) 3.2/3.6mil (3.0/3.3mil)
29 Min. line width/spacing (35um copper) 4.0/4.3mil (3.5/3.8mil) 3.5/3.8mil  (3.3/3.6mil)
30 Min. line width/spacing (70um copper) 6.5/6mil (6/5.5mil) 6.0/5.5mil (5.5/5mil)
31 Min. line width/spacing (105um copper) 10/13mil (9.5/12.5mil) 9.5/12.5mil (9/12mil)
32 Min.line width/spacing(18um copper, flex on the surface of board) 5/5mil (4.5/4.5mil) 4.5/4.5mil (4/4mil)
33 Min.line width/spacing(35um copper, flex on the surface of board) 5.5/6mil (5/5.5mil) 5/5.5mil (4.5/5mil)
34 Min.line width/spacing(70um copper, flex on the surface of board) 7.0/8.0mil (6.5/7.5mil) 6.5/7.5mil (6/7.0mil)
35 Min.BGA pad size 12mil(8mil for electrical soft gold board) 10mil(7mil for electrical soft gold board)
36 Max.Copper thickness 3oz 5oz
37 Min.Copper thickness 1/2oz 1/2oz
38 Finish Line tolerance ±1.5mil ±1mil
39 Testing method Electrical testing Flying needle test, needle bed test Flying needle test, needle bed test
40 Surface treatment Surface treatment HASL/LF HASL, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Immersion silver, Immersion tin and OSP HASL/LF HASL, ENIG, ENEPIG, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Immersion silver, Immersion tin and OSP
41 Mixed surface treatment ENIG+OSP,ENIG+Gold finger,Electrical gold+ Gold fingers ENIG+OSP,ENIG+Gold finger,Electrical gold+ Gold fingers
42 Routing Routing Tolerance(Laser) ±0.05mm ±0.05mm
43 Routing Tolerance(CNC) ±0.15mm ±0.1mm
44 Others Via treatment method Through hole window opening, through hole cover oil, through hole plug oil, through hole plug resin/copper paste Through hole window opening, through hole cover oil, through hole plug oil, through hole plug resin/copper paste
45 Warp and Twist ≤0.7% ≤0.5%
46 Controlled Impedance ±10% ±5%
47 Special process Gold fingers, half-holes, metal edging, stepped grooves, etc. Gold fingers, half-holes, metal edging, stepped grooves, etc.