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RF PCBs – Radio Frequency PCBs

Radio frequency (RF) microwave circuit boards are printed circuit boards specifically designed for processing high-frequency signals (typically in the 300MHz to 300GHz range). They play a crucial role in high-frequency applications such as wireless communication, radar systems, and satellite equipment, responsible for achieving low-loss, high-fidelity signal transmission. The core characteristic of RF microwave circuit boards lies in their high-frequency adaptability, requiring strict control of signal integrity. Key design parameters include: low insertion loss, precise impedance control, stable dielectric constant, and low dielectric loss tangent. These characteristics are achieved through optimized substrate selection (such as PTFE or ceramic filler materials), wiring structure, and shielding design to address high-frequency effects such as skin effect and parasitic parameters.

UMEC works closely with your product design team, providing information on material options, relative costs and DFM considerations to ensure projects achieve their benefit objectives.

If you need further information or assistance, please contact us and we will be happy to help.

Our technical capability for RF PCBs

The table below shows some of our basic process capability parameters. If you don’t find the information you need in the table, please contact us and we will be happy to help you solve your problem. In addition, other pages also have information about board materials and other types of circuit boards, which can help you make design or production decisions.

RF PCB Manufacture  Capabilites
No. Item Standard Advanced
1 Materials Materials F4B/Rogers/Taconic/Arlon/Panasonic F4B/Rogers/Taconic/Arlon/Panasonic
2 Basic parameters Layers 1-42L 44-64L
3 Max.Board size 500*500mm 1200*600mm
4 Min.Board size 5*5mm 3*3mm
5 Max.Board thickness 6mm 12mm
6 Min.Board thickness 0.3mm 0.2mm
7 Tolerance of board thickness(>1.0mm) ±10% ±10%
8 Tolerance of board thickness(≤1.0mm) ±0.1mm ±0.1mm
9 Drilling Min.Drilling hole(mech) 0.2mm 0.15mm
10 Min.Buried hole(mech) 0.3mm 0.2mm
11 Finish hole tolerance(PTH) ±0.075mm ±0.075mm
12 Finish hole tolerance(NPTH) ±0.05mm ±0.05mm
13 Hole position deviation ±0.075mm ±0.075mm
14 Min.Distance between via and conductors 0.2mm 0.12mm
15 Min.Drilling spacing between holes(the same network) 0.2mm 0.15mm
16 Min.Drilling spacing between holes(for different networks) 0.3mm 0.2mm
17 Aspect ratio(mech drill) 10:1 20:1
18 Inner layer Min.Line width/space 4/4mil 3/3mil
19 Max.Copper thickness 2oz 3oz
20 Min.Copper thickness 0.5oz 0.3oz
21 Outer layer Min.Line width/space 4/4mil 3/3mil
22 Max.Copper thickness 2oz 3oz
23 Min.Copper thickness 0.5oz 0.3oz
24 Min.BGA pad size 12mil(8mil for electrical soft gold board) 10mil(7mil for electrical soft gold board)
25 Finish Line tolerance ±1.5mil ±1mil
26 Testing method Electrical testing Flying needle test, needle bed test Flying needle test, needle bed test
27 Surface treatment Surface treatment HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Plating Tin, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Ink. HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Plating Tin, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Ink.
28 Mixed surface treatment GF+OSP, GF+HASL, OSP+ENIG, IAG+GF, Isn+GF GF+OSP, GF+HASL, OSP+ENIG, IAG+GF, Isn+GF
29 Routing Routing Tolerance(Laser) ±0.05mm ±0.05mm
30 Routing Tolerance(CNC) ±0.15mm ±0.1mm
31 Others Via treatment method Through hole window opening, through hole cover oil, through hole plug oil, through hole plug resin/copper paste Through hole window opening, through hole cover oil, through hole plug oil, through hole plug resin/copper paste
32 Warp and Twist ≤0.7% ≤0.5%
33 Controlled Impedance ±10% ±5%
34 Special process Gold fingers, half-holes, metal edging, stepped grooves, etc. Gold fingers, half-holes, metal edging, stepped grooves, etc.