| RF PCB Manufacture Capabilites |
| No. |
Item |
Standard |
Advanced |
| 1 |
Materials |
Materials |
F4B/Rogers/Taconic/Arlon/Panasonic |
F4B/Rogers/Taconic/Arlon/Panasonic |
| 2 |
Basic parameters |
Layers |
1-42L |
44-64L |
| 3 |
Max.Board size |
500*500mm |
1200*600mm |
| 4 |
Min.Board size |
5*5mm |
3*3mm |
| 5 |
Max.Board thickness |
6mm |
12mm |
| 6 |
Min.Board thickness |
0.3mm |
0.2mm |
| 7 |
Tolerance of board thickness(>1.0mm) |
±10% |
±10% |
| 8 |
Tolerance of board thickness(≤1.0mm) |
±0.1mm |
±0.1mm |
| 9 |
Drilling |
Min.Drilling hole(mech) |
0.2mm |
0.15mm |
| 10 |
Min.Buried hole(mech) |
0.3mm |
0.2mm |
| 11 |
Finish hole tolerance(PTH) |
±0.075mm |
±0.075mm |
| 12 |
Finish hole tolerance(NPTH) |
±0.05mm |
±0.05mm |
| 13 |
Hole position deviation |
±0.075mm |
±0.075mm |
| 14 |
Min.Distance between via and conductors |
0.2mm |
0.12mm |
| 15 |
Min.Drilling spacing between holes(the same network) |
0.2mm |
0.15mm |
| 16 |
Min.Drilling spacing between holes(for different networks) |
0.3mm |
0.2mm |
| 17 |
Aspect ratio(mech drill) |
10:1 |
20:1 |
| 18 |
Inner layer |
Min.Line width/space |
4/4mil |
3/3mil |
| 19 |
Max.Copper thickness |
2oz |
3oz |
| 20 |
Min.Copper thickness |
0.5oz |
0.3oz |
| 21 |
Outer layer |
Min.Line width/space |
4/4mil |
3/3mil |
| 22 |
Max.Copper thickness |
2oz |
3oz |
| 23 |
Min.Copper thickness |
0.5oz |
0.3oz |
| 24 |
Min.BGA pad size |
12mil(8mil for electrical soft gold board) |
10mil(7mil for electrical soft gold board) |
| 25 |
Finish Line tolerance |
±1.5mil |
±1mil |
| 26 |
Testing method |
Electrical testing |
Flying needle test, needle bed test |
Flying needle test, needle bed test |
| 27 |
Surface treatment |
Surface treatment |
HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Plating Tin, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Ink. |
HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Plating Tin, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Ink. |
| 28 |
Mixed surface treatment |
GF+OSP, GF+HASL, OSP+ENIG, IAG+GF, Isn+GF |
GF+OSP, GF+HASL, OSP+ENIG, IAG+GF, Isn+GF |
| 29 |
Routing |
Routing Tolerance(Laser) |
±0.05mm |
±0.05mm |
| 30 |
Routing Tolerance(CNC) |
±0.15mm |
±0.1mm |
| 31 |
Others |
Via treatment method |
Through hole window opening, through hole cover oil, through hole plug oil, through hole plug resin/copper paste |
Through hole window opening, through hole cover oil, through hole plug oil, through hole plug resin/copper paste |
| 32 |
Warp and Twist |
≤0.7% |
≤0.5% |
| 33 |
Controlled Impedance |
±10% |
±5% |
| 34 |
Special process |
Gold fingers, half-holes, metal edging, stepped grooves, etc. |
Gold fingers, half-holes, metal edging, stepped grooves, etc. |