EN_US

Multilayer PCBs

Multilayer circuit boards are composite circuit boards consisting of three or more conductive layers. Each layer is isolated by an insulating dielectric layer and electrically connected by plated through-holes. The outer layer is a double-sided trace layer, while the inner conductive layers are integrated within an insulating board. Single/double-layer circuit boards are stacked using optical positioning and layer-by-layer lamination processes to form a multilayer substrate. The stacked structure is crucial; the thickness of each dielectric layer directly affects the circuit impedance characteristics, signal integrity, and heat dissipation performance.

Multilayer circuit boards, as a type of printed circuit board, are primarily classified based on material properties:

Multilayer circuit boards can be divided into standard and special types according to the mechanical and electrical properties of the substrate.

Standard types mainly use FR-4 epoxy glass cloth substrate, which has good mechanical strength and general electrical properties, suitable for most general electronic devices.

Special types include high-frequency boards (such as those using polytetrafluoroethylene, suitable for radio frequency and microwave communications), metal substrates (such as aluminum substrates, which have excellent heat dissipation and are used in high-power power supplies), and ceramic substrates (which have high heat resistance and stability, suitable for high-temperature environments), etc.

Many products use multilayer PCBs, including computers, medical equipment, in-car systems, GPS and satellite systems, industrial control systems.It is the core carrier of modern high-end, complex electronic devices.

The multilayer PCB segment is a big part of our production.Our company specializes in the production of high-quality multilayer PCBs, utilizing state-of-the-art equipment and technology. We are capable of producing multilayer PCBs with a high layer count, ensuring stability, reliability, and optimal electrical performance. Whether it’s for complex industrial control systems, medical devices, or automotive applications, our manufacturing processes meet the highest industry standards, providing robust solutions for demanding projects.

If you need further information or assistance, please contact us and we will be happy to help.

Our technical capability for multilayer PCBs

The table below shows some of our basic process capability parameters. If you don’t find the information you need in the table, please contact us and we will be happy to help you solve your problem. In addition, other pages also have information about board materials and other types of circuit boards, which can help you make design or production decisions.

Multilayer PCB Manufacture Capabilites
No. Item Standard Advanced
1 Materials Materials FR-4 Middle, High Tg, Halogen Free, High CTI, High Speed FR-4 Middle, High Tg, Halogen Free, High CTI, High Speed
2 Basic parameters Layers 4-42L 44-64L
3 Max.Board size 1100*660mm 1400*800mm
4 Min.Board size 5*5mm 3*3mm
5 Max.Board thickness 6mm 12mm
6 Min.Board thickness 0.3mm 0.2mm
7 Tolerance of board thickness(1.0mm) ±10% ±10%
8 Tolerance of board thickness(≤1.0mm) ±0.1mm ±0.1mm
9 Drilling Min.Drilling hole(mech) 0.2mm 0.15mm
10 Min.Drilling hole(laser) 0.1mm 0.075mm
11 Finish hole tolerance(PTH) ±0.075mm ±0.075mm
12 Finish hole tolerance(NPTH) ±0.05mm ±0.05mm
13 Hole position deviation ±0.075mm ±0.05mm
14 Min.Distance between via and conductors 0.2mm 0.12mm
15 Min.Drilling spacing between holes(the same network) 0.2mm 0.15mm
16 Min.Drilling spacing between holes(for different networks) 0.3mm 0.2mm
17 Aspect ratio(mech drill) 10:1 20:1
18 Inner layer Min.Line width/space 4/4mil 2/2mil
19 Max.Copper thickness 10oz 12oz
20 Min.Copper thickness 0.5oz 0.3oz
21 Outer layer Min.Line width/space 4/4mil 2.5/2.5mil
22 Max.Copper thickness 10oz 12oz
23 Min.Copper thickness 0.5oz 0.5oz
24 Min.BGA pad size 12mil(8mil for electrical soft gold board) 10mil(7mil for electrical soft gold board)
25 Finish Line tolerance ±1.5mil ±1mil
26 Testing method Electrical testing Flying needle test, needle bed test Flying needle test, needle bed test
27 Surface treatment Surface treatment HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Plating Tin, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Ink. HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Plating Tin, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Ink.
28 Mixed surface treatment GF+OSP, GF+HASL, OSP+ENIG, IAG+GF, Isn+GF GF+OSP, GF+HASL, OSP+ENIG, IAG+GF, Isn+GF
29 Routing Routing Tolerance(Laser) ±0.05mm ±0.05mm
30 Routing Tolerance(CNC) ±0.15mm ±0.1mm
31 Others Via treatment method Through hole window opening, through hole cover oil, through hole plug oil, through hole plug resin/copper paste Through hole window opening, through hole cover oil, through hole plug oil, through hole plug resin/copper paste
32 Warp and Twist ≤0.7% ≤0.5%
33 Controlled Impedance ±10% ±5%
34 Special process Gold fingers, half-holes, metal edging, stepped grooves, etc. Gold fingers, half-holes, metal edging, stepped grooves, etc.