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PCB MATRIX

Ceramic PCBs

Ceramic circuit boards are circuit boards that use ceramic materials as the insulating substrate. Through various process technologies such as DPC/DBC/HTCC/LTCC, the ceramic substrate is made into a ceramic circuit board with circuitry, metal holes, and a metallized surface treatment, possessing thermal and electrical conductivity properties. It is a completely different product from the most common FR-4 glass fiber epoxy resin circuit board. The advantages of ceramic circuit boards stem from their material properties: excellent heat dissipation, superior high-frequency/high-speed performance, extremely high thermal stability and weather resistance, high insulation, and stability. These advantages have led to a rapid increase in demand for ceramic circuit boards in high-performance applications, and their usage is expanding rapidly.

Ceramic PCB – 2L: materials: Al₂O₃ 96%; finished thickness: 2.0mm +/- 10%; Min.hole size: 0.30mm; surface treatment: ENIG

Ceramic PCB – 2L: materials: Sapphire; finished thickness: 1.5mm +/- 10%; surface treatment: ENIG

Ceramic circuit boards mainly include types such as alumina (Al₂O₃), aluminum nitride (AlN), silicon nitride (Si₃N₄), and beryllium oxide (BeO).

Alumina circuit boards have good electrical insulation and moderate thermal conductivity, offering high cost-effectiveness and wide application.

Aluminum nitride circuit boards have even higher thermal conductivity and a coefficient of thermal expansion matching silicon, making them suitable for high-power and high-frequency applications.

Silicon nitride circuit boards possess excellent mechanical strength and chemical stability, often used in high-performance microwave components.

Beryllium oxide circuit boards have extremely high thermal conductivity and are widely used in the semiconductor field; however, due to the high toxicity of beryllium oxide powder, they have been gradually replaced by materials such as AlN and are now rarely used.

UMEC currently manufactures various types of ceramic circuit boards, as well as irregularly shaped components. Production capacity is continuously increasing, enabling us to meet the customized and mass production needs of different customers.

If you need further information or assistance, please contact us and we will be happy to help.

Our technical capability for Ceramic PCBs

The table below shows some of our basic process capability parameters. If you don’t find the information you need in the table, please contact us and we will be happy to help you solve your problem. In addition, other pages also have information about board materials and other types of circuit boards, which can help you make design or production decisions.

Ceramic PCB Manufacture  Capabilites
No. Item Standard Advanced
1 Materials Materials Al₂O₃ 96%; Al₂O₃ 99%; AlN(≥170 W/MK); AlN(≥200 W/MK) SiC; Si3N4; ZrO2; ZTA
2 Basic parameters Layers 1-2L 4-6L
3 Max.Board size 120*120mm 300*300mm
4 Min.Board size 1.0*1.0mm 0.3*0.3mm
5 Max.Board thickness 3.0mm 10.0mm customized
6 Min.Board thickness 0.2mm 0.1mm
7 Tolerance of board thickness(＞1.0mm) ±10% ±10%
8 Tolerance of board thickness(≤1.0mm) ±0.1mm ±0.1mm
9 Drilling Min.Drilling hole(mech) 0.2mm 0.15mm
10 Min.Drilling hole(laser) 0.1mm 0.06mm
11 Finish hole tolerance(PTH) ±0.05mm ±0.025mm
12 Finish hole tolerance(NPTH) ±0.05mm ±0.05mm
13 Hole position deviation ±0.075mm ±0.05mm
14 Min.Distance between via and conductors 0.2mm 0.12mm
15 Min.Drilling spacing between holes(the same network) 0.2mm 0.15mm
16 Min.Drilling spacing between holes(for different networks) 0.3mm 0.2mm
17 Aspect ratio(laser drill) 1:8 1:10
18 Inner layer Min.Line width/space 2/2mil 0.8/0.8mil
19 Max.Copper thickness 2oz 2oz
20 Min.Copper thickness 1/2oz 1/3oz
21 Outer layer Min.Line width/space 2/2mil 0.8/0.8mil
22 Max.Copper thickness 28oz 28oz
23 Min.Copper thickness 1/2oz 1/3oz
24 Min.BGA pad size 12mil(8mil for electrical soft gold board) 12mil(8mil for electrical soft gold board)
25 Finish Line tolerance 0.8mil 0.4mil
26 Copper cladding process DPC + Electroplating DPC + Electroplating
27 Testing method Electrical testing Flying needle test, needle bed test, impedance test, resistance test Flying needle test, needle bed test, impedance test, resistance test
28 Surface treatment Surface treatment ENIG, ENEPIG, Immersion silver, OSP, blue glue, carbon oil ENIG, ENEPIG, Immersion silver, OSP, blue glue, carbon oil
29 Routing Cutting method Laser, Waterjet Cutting (with Blue Film Backing) Laser, Waterjet Cutting (with Blue Film Backing)
30 Routing Tolerance(Laser) ±0.1mm ±0.02mm
31 Others Via treatment method Through hole window opening, through hole cover oil, through hole plug oil, through hole plug resin/copper paste Through hole window opening, through hole cover oil, through hole plug oil, through hole plug resin/copper paste
32 Warp and Twist ≤0.7% ≤0.5%
33 Controlled Impedance ±10% ±5%
34 Special process Half-holes, metal edging, stepped grooves, damming Half-holes, metal edging, stepped grooves, damming